Zhengzhou Sanmao Project won the second prize of "China Machinery Industry Science and Technology Award"

Abstract It was learned from China Machine Tool & Tool Industry Association that the 2009 machine tool industry was declared to participate in the “China Machinery Industry Science and Technology Award” for a total of 49 evaluations, which were reviewed by the Machine Tool Professional Group of the China Machinery Industry Science and Technology Awards Evaluation Committee...

It was learned from the China Machine Tool Industry Association that in 2009, the machine tool industry was declared to participate in the “China Machinery Industry Science and Technology Award” for a total of 49 evaluations. It was reviewed by the Machine Tool Professional Group of the China Machinery Industry Science and Technology Awards Evaluation Committee and reported to the Chinese Machinery Industry Science and Technology. Approved by the Award Management Committee, 24 projects were awarded. Among them, Zhengzhou Abrasives Abrasive Grinding Research Institute won the second prize of “China Machinery Industry Science and Technology Award” for “The Research on Diamond Abrasive for High-efficiency Ultra-precision Grinding of IC Wafer”. Congratulations on China Superhard Materials Network.
According to reports, wafer processing is an important part of the IC manufacturing system. The processing precision, surface roughness and surface integrity of the silicon wafer directly affect the line width of the IC and the performance of the IC chip. The silicon thinned diamond grinding wheel is mainly used in the semiconductor industry to process IC silicon wafers such as IC wafer back surface thinning and silicon ingot chamfering. The processing performance of the silicon wafer directly affects the IC quality and plays an important role in the semiconductor industry. The project developed a diamond wheel suitable for ceramic bonding and resin bonding of IC wafers and discrete components. Its dynamic balance accuracy reaches ≤G2.5; parallelism ≤0.015mm, outer circle jump ≤0.005mm; service life>20 million pieces (6 inches); use line speed 50m/s; precision silicon wafer accuracy ≤0.005mm ; bending degree ≤ 0.5mm.
This product has been replaced by imported similar products, and it is used normally in various types of grinding machines in more than 10 domestic enterprises.

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