Direct Wafer is a commercially viable new wafer manufacturing process successfully developed by American 1366 Technology. In the direct method silicon wafer, polycrystalline silicon is put into a silicon wafer growth furnace, heated to melt it, and then the surface layer is cooled and crystallized to grow a polycrystalline silicon wafer. “It’s like freezing the lake in winter. Then the wafer is taken out and cut to the required size, and the cut silicon can be recycled.†Frank Van Mirlo, CEO of 1366 Technology, is receiving the reporter. In the interview, "In this way, the direct method silicon wafer reduces the production steps of silicon ingot casting and cutting, avoids the waste of silicon, can reduce the cost by 50%, and saves 2/3 of the total energy consumption of the entire wafer. ""
Direct method silicon wafer characteristics
On May 5, 2016, 1366 Technology announced that it has received a $10 million investment from Hanwha Q CELLS Investment Co., one of Korea's leading private equity/ venture capital firms. In March 2017, using this technology, 1366 Technology and Hanwha Q CELLS cooperated to achieve 19.9% ​​battery conversion efficiency. After 8 months, the battery conversion efficiency increased from 19.6% to 20.3%. “The results were independently confirmed by the photovoltaic calibration laboratory of the Fraunhofer Institute for Solar Energy Systems in Germany. The direct wafer manufacturing technology combined with the new battery structure is comparable in efficiency to single crystal, and the efficiency improvement of 1% per year is "Millow said that direct silicon manufacturing technology is also achieving new levels of performance while promoting cost reduction, and this superior performance comes from its unique manufacturing process - high purity growth environment, and more Good microstructure and gradient of doping concentration.
The picture above shows the component picture, the products on both sides are made of direct silicon, and the middle blue component is made of normal silicon.
On February 27, 2019, 1366 Technology and its strategic partner Hanwha Q CELLS officially announced that the world's first production plant using direct silicon technology is about to be completed, and the direct wafer mass production plan is on the agenda. The plant is located in Cyberjaya, which is known as the “Silicon Valley†in Malaysia, adjacent to the battery and component manufacturing workshop of Hanwha Q CELLS. In the future, these produced silicon wafers will be directly supplied to Hanwha Q CELLS' battery and component production lines. It is expected to reach production no later than the third quarter of 2019. After the product meets key indicators, the production capacity will be expanded to multiple GW levels.
1366 Technology and Hanwha Q CELLS cooperate to establish the world's first direct silicon wafer factory
Little impact on the diamond wire cutting industry
Since 2016, when the direct method silicon wafer has not yet been mass-produced, the diamond wire cutting industry has ushered in a blowout development. With the maturity of technologies such as black silicon and PERC, the problem of back-end flocking process caused by diamond-cut polycrystalline is solved, and the cost is greatly reduced while improving the efficiency of the battery, achieving the effect of 1+1+1>3, making the polycrystalline battery conversion The rate reached 20.5%, which is more efficient than the 20.3% battery release announced by 1366 Technology.
Direct wafer manufacturing cost announced by 1366 Technology Corporation in July 2016
Diamond wire cutting costs are lower. 1366 Technology announced in July 2016 that the silicon manufacturing cost is about 0.35 US dollars / piece, equivalent to 2.34 yuan / piece, the market price of silicon at that time is 5.35 yuan / piece. The current price of polysilicon has fallen by more than half compared with 2016. According to statistics from the Silicon Branch, in early March, the price of polysilicon was between 2.05 and 2.30 yuan per piece, and the average price was 2.15 yuan per piece. The cost of diamond wire cutting polysilicon was lower. .
Therefore, according to the cost and silicon performance originally envisaged by 1366 Technology, there is basically no impact on the current diamond wire cutting industry.
However, because 1366 Technology has not announced the current silicon wafer manufacturing cost and performance, it does not rule out the possibility of improvement in production processes and equipment. For diamond wire cutting companies, direct method silicon wafers are a challenge. Only technology updates, quality improvement, and cultivation can not be afraid of any challenges!
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