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The technology company with a military background is really a Cryolophos. Sandia, a company affiliated with Loma, has previously introduced a heat-dissipation technology with a 30-fold increase in efficiency. GE, a US company, recently announced a breakthrough heat-dissipation technology. Its volume is comparable to credit cards and can be used in the next generation of ultra-thin flat panels and notebooks.
This type of radiator is called DCJ (Dual Piezoelectric Cooling Jets), which can be understood as a micro-flow bellows that injects high-speed air to electronic equipment. DCJ emits 10 times more turbulent air than conventional convection air. Heat exchange rate.
Peter de Bock, an electronic thermal engineer at GE Global Research Center, said: “The revolutionary DCJ cooling technology from aero engines and turbine generators can greatly reduce pressure loss and load characteristics. We have been playing acoustics for the past 18 months. , vibration and power consumption are adjusted, and the optimized DCJ heat dissipation can eventually become the best heat dissipation device for ultra-thin electronic devices."
Compared with existing heat sinks, DCJ radiators have a thickness of only 4mm, a 50% reduction, and power consumption is only half that of fan heatsinks. In addition, its simple architecture is also more reliable than traditional heatsinks. Sexuality and maintainability.
GE currently wants OEMs to provide DCJ development kits to simulate the use of DCJ heat sinks on next-generation products. In addition, GE has provided DCJ authorization to Fujikura, a world-renowned thermal solution solution company, and its products are widely used in television, automation, automotive, and electronics industries.
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